1211 Chassis Cooling
CS500 model 1211 chassis cooling components, monitoring, and temperature management.
Six system fans, power supply fans, an air duct, populated drive carriers, and installed CPU heats sinks within the 1211 chassis are designed to dissipate heat. Drive carriers can be populated with a storage device (SSD or HDD) or supplied drive blank. In addition, it may be necessary to have specific DIMM slots populated with DIMMs or supplied DIMM blanks.
The CPU 1 processor and heatsink must be installed first. The CPU 2 heatsink must be installed at all times, with or without a processor installed.
With fan redundancy, should a single fan failure occur (system fan or power supply fan), integrated platform management changes the state of the system status LED to blinking green, reports an error to the system event log, and automatically adjusts fan speeds as needed to maintain system temperatures below maximum thermal limits.
All fans in the fan assembly and power supplies are controlled independent of each other. The fan control system may adjust fan speeds for different fans based on increasing/decreasing temperatures in different thermal zones within the chassis.
If system temperatures continue to increase above thermal limits with system fans operating at their maximum speed, platform management may begin to throttle bandwidth of either the memory subsystem or processors or both, to keep components from overheating and keep the system operational. Throttling of these subsystems will continue until system temperatures are reduced below preprogrammed limits.
The power supply module will shut down if its temperature exceeds an over-temperature protection limit. If system thermals increase to a point beyond the maximum thermal limits, the server will shut down, the System Status LED changes to solid Amber, and the event is logged to the system event log. If power supply temperatures increase beyond maximum thermal limits or if a power supply fan fail, the power supply will shut down.
System Fans
The system is designed for fan redundancy when configured with two power supply modules. Should a single system fan fail, platform management adjusts air flow of the remaining system fans and manages other platform features to maintain system thermals. Fan redundancy is lost if more than one system fan is in a failed state.
The fan assembly must be removed when routing cables inside the chassis from back to front, or when motherboard replacement is necessary.
- Each individual fan is hot-swappable.
- Each fan is blind mated to a matching 6-pin connector located on the motherboard.
- Each fan is designed for tool-less insertion and extraction from the fan assembly.
- Each fan has a tachometer signal that allows the integrated BMC to monitor its status.
- Fan speed for each fan is controlled by integrated platform management. As system thermals fluctuate high and low, the integrated BMC firmware increases and decreases the speeds to specific fans within the fan assembly to regulate system thermals.
- An integrated fault LED is located on the top of each fan. Platform management illuminates the fault LED for the failed fan.
Chassis Air Duct
An air duct provides proper air flow for add-on cards that use a passive heatsink. The air duct is mounted behind the fan assembly. Cables in the chassis that run from front to back are routed in cable channels between the chassis sidewall and sidewalls of the air duct. Cables should not be run through the center of the chassis or between the system fans and DIMM slots.
