S2600WF Processor Socket Assembly

CS500 Intel S2600WF motherboard Skylake socket and processor components.

Unlike previous Intel® Xeon® E5-2600 (v3/v4) processors that use an integrated loading mechanism (ILM), the CS500 S2600WF motherboard includes two Socket-P0 (LGA 3647) processor sockets that supports Intel Xeon Scalable family processors. The socket features a rectangular shape which is different from the square shape of previous sockets. The LGA 3647 socket contains 3647 pins and provides I/O, power, and ground connections from the motherboard board to the processor package. Because of the large size of the socket, it is made of two C-shaped halves. The two halves are not interchangeable and are distinguishable from one another by the keying and pin1 insert colors: The left half keying insert is the same color as the body, the right half inserts are white.

Important: Previous-generation Intel® Xeon® (v3/v4) processors and their supported CPU heatsinks are not supported on the S2600WF.

The LGA 3647 socket also supports the Intel Xeon Scalable processors with embedded Omni-Path Host Fabric Interconnect (HFI).

The pins inside the processor socket are extremely sensitive. No object except the processor package should make contact with the pins inside the processor socket. A damaged socket pin may render the socket inoperable, and will produce erroneous CPU or other system errors.

Processor Heat Sink Module (PHM): The PHM refers to the sub-assembly where the heatsink and processor are fixed together by the processor package carrier prior to installation on the motherboard. The PHM is properly installed when it is securely seated over the two Bolster Plate guide pins and it sits evenly over the processor socket. Once the PHM is properly seated over the processor socket assembly, the four heatsink Torx screws must be tightened in the order specified on the label affixed to the top side of the heatsink.
Processor Package Carrier (Clip): The carrier is an integral part of the PHM. The processor is inserted into the carrier, then the heatsink with thermal interface material (TIM) are attached. The carrier has keying/alignment features to align to cutouts on the processor package. These keying features ensure the processor package snaps into the carrier in only one direction, and the carrier can only be attached to the heatsink in one orientation.; The processor package snaps into the clips located on the inside ends of the package carrier. The package carrier with attached processor package is then clipped to the heatsink. Hook like features on the four corners of the carrier grab onto the heatsink. All three pieces are secured to the bolster plate with four captive nuts that are part of the heatsink.; Important: Fabric supported processor models require the use of a Fabric Carrier Clip which has a different design than the standard clip shown in the figure below. Attempting to use a standard processor carrier clip with a Fabric supported processor may result in component damage and result in improper assembly of the PHM.
Bolster Plate: The bolster plate is an integrated subassembly that includes two corner guide posts placed at opposite corners and two springs that attach to the heatsink via captive screws. Two Bolster Plate guide pins of different sizes allows the PHM to be installed only one way on the processor socket assembly.; The springs are pulled upward as the heatsink is lowered and tightened in place, creating a compressive force between socket and heatsink. The bolster plate provides extra rigidity, helps maintain flatness to the motherboard, and provides a uniform load distribution across all contact pins in the socket.
Heatsink: The heatsink is integrated into the PHM which is attached to the bolster plate springs by two captive nuts on either side of the heatsink. The bolster plate is held in place around the socket by the backplate. The heatsink's captive shoulder nuts screw onto the corner standoffs and bolster plate studs. Depending on the manufacturer/model, some heatsinks may have a label on the top showing the sequence for tightening and loosening the four nuts.; There are two types of heatsinks, one for each of the processors. These heatsinks are NOT interchangeable and must be installed on the correct processor/socket, front versus rear.

Figure: S2600BP Processor Socket Assembly

Processor Socket Cover

To protect the pins within a processor socket from being damaged, a motherboard with no processor or heatsink installed must have a plastic cover installed over each processor socket. Processor socket covers must be removed before processor installation.